Flash Extractor
Soft-Center
About     Shop     Downloads     Manual     Library     Forum     Services     Contacts
BGA chip reballing

1. Clean up the pads on the chip from residues of solder



2. Use BGA balls like shown on picture or the same. Diameter must be not less than 0.4mm and not more than 0.45mm



3. Use BGA Gel flux like shown on picture or the same



4. Apply a thin layer of flux over the entire surface of the contact group Remove excess flux.



5. Place balls on the pads by a thin pair of tweezers. Make sure the balls not roll from the pads, and not stick together/other



6. Use hot air gun to the bottom of chip. Set temperature 300-310 C. Do not expose the air stream onto the working surface!



7. After the warm-up by heating gun balls will be placed at the contact pads by themselves. Remove excess of flux from chip at the end of job

Last added
SSS6696   98 d7 94 32   1x1 UP309   45 3c 98 b3   1x1 EN3257LT Q AB   2c 84 64 54   1x1   v2 PS2251-08-Q   98 de 94 93   2x4 SM3257EN Q AA   45 d7 98 b2   1x1 IS916EN   98 d7 98 92   1x1 SM321QF CC   2c d7 d5 3e   1x2 SSS6137   45 3e 98 b3   1x1 IT1178D   98 d7 94 32   1x1 AU6998SN   2c 84 64 3c   1x2
News
21.07.2020 RR manual updated
10.07.2020 Power adapter in stock
05.05.2020 RR even and odd blocks
10.03.2020 RR for ad 3a 18 03
01.12.2019 Power Adapter v3
Other products
Soft-Center ltd.