Flash Extractor
Soft-Center
About     Shop     Downloads     Manual     Library     Forum     Services     Contacts
BGA chip reballing

1. Clean up the pads on the chip from residues of solder



2. Use BGA balls like shown on picture or the same. Diameter must be not less than 0.4mm and not more than 0.45mm



3. Use BGA Gel flux like shown on picture or the same



4. Apply a thin layer of flux over the entire surface of the contact group Remove excess flux.



5. Place balls on the pads by a thin pair of tweezers. Make sure the balls not roll from the pads, and not stick together/other



6. Use hot air gun to the bottom of chip. Set temperature 300-310 C. Do not expose the air stream onto the working surface!



7. After the warm-up by heating gun balls will be placed at the contact pads by themselves. Remove excess of flux from chip at the end of job

Last added
PS2251-07-V   98 3a 85 93   1x4 EN2683B-BA   ec d7 94 7a   1x4 SM3267L-AB   ec 3c d9 bf   2x2 Monolith Micro SD SD_20 v2   98 d7 94 32   1x1 SMI2702BX   89 88 24 4b   1x8 PS2251-02-Q   98 de 94 82   1x4 PS2251-38-5   89 68 04 46   2x2 SM325QF-AC   ec d7 55 b6   4x2 SSS6132   98 3c 98 b3   1x1 STC2702BX   2c a4 e5 54   1x8
News
20.04.2018 Sector Number Slow
17.03.2018 Adapter BGA-272
22.02.2018 Bad Bytes Editor
18.10.2017 Power adapter
07.10.2016 Conatiner v9
Other products
Soft-Center ltd.